3rd Dresden Nanoanalysis Symposium (DNS), 2015

Encouraged by the success and positive reception of the previous years, we invited to the 3rd Dresden Nanoanalysis Symposium (DNS) jointly organized with the Fraunhofer Cluster Nanoanalysis (DFCNA).
The participants had an excellent opportunity to make new contacts and to renew old ones. A poster session complemented the comprehensive technical program.
The 3rd DNS took place at the Dülfersaal at Technische Universität Dresden at April 17th, 2015.
With 80 participants the 3rd DNS was again a successful event and will be soon followed by the 4th Nanoanalysis Symposium.

Program of the 3rd DNS at April 17th, 2015

  • Material modeling, numerical simulation and characterization - Basis for modern materials science and engineering
    Krzysztof Kurzydlowski, NCBiR Warsaw, Poland
  • Combining X-ray microtomography with the finite elements method to study damage and cracking in structural materials
    Henry Proudhon, Centre des Matériaux MINES Paristech, France
  • Characterization of Nanowires – Electrical, Optical, Thermal
    Heike Riel, IBM Research, Rüschlikon, Switzerland
  • 3D chemical analysis of nanodevices using correlative transmission electron microscopy and atom probe tomography
    Narciso Gambacorti, CEA, LETI, MINATEC Campus, Grenoble, France
  • Materials for a new window of the ICT age
    Rodrigo Martins, University Lisbon, Portugal
  • Organic electronics - A challenge for nanoanalysis
    Karl Leo, Technische Universität Dresden, Germany
  • Characterization of nano-structured polymer systems: From nano-medicine to function electronic materials and smart polymers
    Ulrich S. Schubert, University Jena, Germany
  • Advancements in Electron Microscopy for the Electronics Market
    Laurens Kwakman, FEI, Eindhoven, Netherlands
  • Recent Applications of an Environmental, Aberration-corrected TEM for Nanomaterial Studies
    Robert Sinclair, Stanford University, Palo Alto/CA, USA
  • Nano X-ray tomography – Novel concepts and applications for energy storage
    Jürgen Gluch, Fraunhofer Institute for Ceramic Technologies and Systems Dresden, Germany
  • Fracture toughness and crack propagation analysis for metal-dielectric stacks
    Michael Hecker, GLOBALFOUNDRIES, Dresden, Germany

Sponsors

3rd DNS was kindly supported by the following sponsors:

Chairs and Committee


Symposium Chair

Ehrenfried Zschech; Fraunhofer IKTS-MD, Dresden (Germany) and Dresden Center for Nanoanalysis, Dresden (Germany)

Scientific Committee Members

  • Thomas Chudoba; ASMEC, Radeberg-Rossendorf (Germany)
  • Reiner Dietsch; AXO, Dresden (Germany)
  • Lukas Eng; Technische Universität Dresden, Dresden (Germany)
  • Hans-Jürgen Engelmann; Globalfoundries, Dresden (Germany)
  • Narciso Gambacorti; CEA LETI MINATEC, Grenoble (France)
  • Christoph Gerber; University of Basel (Switzerland)
  • Joachim Mayer; Ernst Ruska-Centre, Jülich (Germany)
  • Andreas Leson; Fraunhofer IWS, Dresden (Germany)
  • Malgorzata Lewandowska; Warsaw University of Technology, Warsaw (Poland)
  • Ulrich Mantz; Carl Zeiss Microscopy, Oberkochen (Germany)
  • Michael Mertig; Technische Universität Dresden, Dresden (Germany)
  • Velimir Radmilovic; University of Belgrade (Serbia) and University of California (USA)
  • Rainer Rauh; EADS, München (Germany)
  • Gerd Schneider; Helmholtz-Zentrum, Berlin (Germany)
  • Robert Sinclair; Stanford University, California (USA)
  • Wilfried Vandervorst, IMEC, Leuven (Netherlands)
  • Oden Warren; Hysitron, Minnesota (USA)
  • Thomas Weissgaerber; Fraunhofer IFAM, Dresden (Germany)